Patent attributes
A communication connector includes a wafer stack including ground wafers and signal wafers arranged in a stacked configuration. Each signal wafer includes a dielectric frame holding a signal leadframe including a plurality of signal contacts. Each ground wafer includes a dielectric frame holding a ground leadframe including ground plates connected by tie bars and rail slots therethrough. The communication connector includes ground rails separate from the ground wafers and being plugged into the wafer stack to electrically connect to corresponding ground wafers. The ground rails have rail tabs received in corresponding rail slots being coupled to ground plates of corresponding ground wafers. Each rail tab extends through at least one signal wafer to provide electrical shielding for signal contacts of the at least one signal wafer. Each rail tab is coupled to at least two different ground wafers to electrically connect the at least two different ground wafers.