Patent attributes
Illustrative embodiments disclosed herein pertain to a cooling apparatus that includes a distributor plate and a conduit assembly. The conduit assembly allows a cooling fluid to flow downwards through a first set of holes in the distributor plate and onto a hot object placed below the distributor plate. The cooling fluid then flows upwards from the hot object into a second set of holes in the distributor plate. The first set of holes are shaped to offer a pressure increase to the cooling fluid flowing towards the hot object. The second set of holes are shaped to offer reduced resistance to the cooling fluid flowing away from the hot object. The distributor plate and the conduit assembly are fabricated from a material that is a heat insulator thereby preventing heat transfer from the cooling fluid flowing away from the hot object to the cooling fluid flowing towards the hot object.
