Patent 10534138 was granted and assigned to Hewlett Packard Enterprise on January, 2020 by the United States Patent and Trademark Office.
In one example, a system for a module board coupling includes a module bracket coupled to a plate, a module board coupled to the plate, a number of frame pins coupled to the module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate.