Patent attributes
A semiconductor thermal-conductive heat sink structure includes a substrate and a thermal-conductive heat sink device. The substrate includes opposed upper and lower planes. A top conductive copper foil is provided on the upper plane to carry a semiconductor device. The thermal-conductive heat sink device includes at least one cooling fin and a high thermal-conductive rivet. A clearance is formed between the cooling fin and a thermal-conductive heat sink device socket or between two adjacent cooling fins such that greater cooling areas are available to the thermal-conductive heat sink device. With the thermal-conductive rivet joining the top conductive copper foil and the cooling fins, heat generated by the activated semiconductor device is quickly conducted through the rivet and dissipated from the greater cooling areas of the cooling fins to prevent malfunction of the semiconductor device attributed to heat accumulation induced by poor heat dissipation.
