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US Patent 10535809 Substrate materials for quantum processors

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
August 29, 2018
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Date of Patent
January 14, 2020
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Patent Application Number
16116481
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Patent Citations
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US Patent 10068181 Microwave integrated quantum circuits with cap wafer and methods for making the same
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Patent Citations Received
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US Patent 11436516 Integrating circuit elements in a stacked quantum computing device
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US Patent 11011693 Integrated quantum circuit assemblies for cooling apparatus
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US Patent 11605772 Vertical dispersive readout of qubits of a lattice surface code architecture
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US Patent 11770982 Microwave integrated quantum circuits with cap wafers and their methods of manufacture
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US Patent 11417819 Forming a bumpless superconductor device by bonding two substrates via a dielectric layer
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US Patent 10769546 Microwave integrated quantum circuits with cap wafer and methods for making the same
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US Patent 10811588 Vertical dispersive readout of qubits of a lattice surface code architecture
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US Patent 11567827 Fault tolerant computation method and apparatus for quantum Clifford circuit, device, and chip
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US Patent 11574230 Microwave integrated quantum circuits with vias and methods for making the same
Patent Inventor Names
Nagesh Vodrahalli
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10535809
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Patent Primary Examiner
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Yasser A Abdelaziez
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