US Patent 10537667 High temperature material for use in medical devices

A material for use in a medical device includes a blend of a non-melt polymer such as Polyamideimide, a meltable carrier polymer such as Polyetherketoneketone and lubricants/rheology modifiers such that the final polymer material can be extruded, pelletized and used to injection mold components for the medical device. The ratios of the Polyamideimide, Polyetherketoneketone and the lubricants are selected to provide sufficient lubricity and glass transition temperature to the material to make it appropriate for use in high temperature applications and additive manufacturing processes.