Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
January 21, 2020
Patent Application Number
15322957
Date Filed
June 30, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (—CONH—).
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