Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chen-Hua Yu0
Ming-Fa Chen0
Date of Patent
January 21, 2020
0Patent Application Number
156939500
Date Filed
September 1, 2017
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A method includes bonding a first device die and a second device die to a substrate, and filling a gap between the first device die and the second device die with a gap-filling material. A top portion of the gap-filling material covers the first device die and the second device die. Vias are formed to penetrate through the top portion of the gap-filling material. The vias are electrically coupled to the first device die and the second device die. The method further includes forming redistribution lines over the gap-filling material using damascene processes, and forming electrical connectors over and electrically coupling to the redistribution lines.
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