Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10542640 Liquid chamber housings

Patent 10542640 was granted and assigned to Hewlett Packard Enterprise on January, 2020 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity

All edits

Edits on 21 Mar, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 21 Mar, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11934237 Hybrid motherboard cooling system for air-cooled servers
0
Edits on 11 Dec, 2023
"Add patent abstract"
Golden AI profile picture
Golden AI
edited on 11 Dec, 2023
Edits made to:
Article (+375 characters)
Article

Patent abstract

Liquid chamber housings are described herein. In one example, an apparatus for liquid chamber housings can include a first housing segment coupled to a first side of a board and a second housing segment coupled to a second side of the board to create a liquid chamber for a portion of the board between the first housing segment and the second housing segment.

Edits on 5 Oct, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 5 Oct, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11778735 Circuit board having a cooling area above and below a semiconductor chip
"Add patent inventor(s)"
Golden AI profile picture
Golden AI
edited on 4 Oct, 2023
Edits made to:
Infobox (+3 properties)
Infobox
Patent Inventor Names
Everett Salinas0
John Franz0
Kevin B. Leigh0
Edits on 27 Sep, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 27 Sep, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11770914 Cooling device and method of manufacturing the same
Edits on 5 Jul, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 5 Jul, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11696424 Power conversion device
0
Edits on 10 May, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 10 May, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11647607 Localized immersion cooling enclosure with thermal efficiency features
0
Edits on 26 Sep, 2022
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 26 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Applicant
Hewlett Packard Enterprise
Hewlett Packard Enterprise
0
Current Assignee
Hewlett Packard Enterprise
Hewlett Packard Enterprise
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
105426400
Date of Patent
January 21, 2020
0
Patent Application Number
161437750
Date Filed
September 27, 2018
0
Patent Citations Received
‌
US Patent 11266012 Circuit board, chip cooling housing, assembly and method for cooling a semiconductor chip
0
Patent Primary Examiner
‌
Zachary Pape
0
Edits on 3 Mar, 2022
"update inverses"
Golden AI profile picture
Golden AI
edited on 3 Mar, 2022
Edits on 1 Feb, 2022
"Created via: Entity Importer"
Golden AI profile picture
Golden AI
created this topic on 1 Feb, 2022
Edits made to:
Infobox (+9 properties)
‌

 US Patent 10542640 Liquid chamber housings

Infobox
Is a
Patent
Patent
Patent applicant
Hewlett Packard Enterprise
Hewlett Packard Enterprise
Current assignee
Hewlett Packard Enterprise
Hewlett Packard Enterprise
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10542640
Date of patent
January 21, 2020
Patent application number
16143775
Date Filed
September 27, 2018
Patent primary examiner
‌
Zachary Pape

Find more entities like US Patent 10542640 Liquid chamber housings

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo