Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
David Lane Smith0
Date of Patent
February 11, 2020
Patent Application Number
16132517
Date Filed
September 17, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.
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