Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 11, 2020
Patent Application Number
16137471
Date Filed
September 20, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
