Is a
Patent attributes
Patent Applicant
0
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seungje Park0
Hyunki Kim0
Date of Patent
February 18, 2020
0Patent Application Number
161999920
Date Filed
November 26, 2018
0Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
A touch sensor assembly may include a sensor mounting portion formed at a insulating substrate, and a soldering spot provided at the sensor mounting portion, wherein a touch sensor is stably fixed to the sensor mounting portion by the soldering spot. In addition, the touch sensor assembly according to an embodiment of the present disclosure includes a copper coating film coated on a insulating substrate, and a top layer printed on the copper coating film, wherein the copper coating film is protected by the top layer.
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