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US Patent 10566219 Chip transfer member, chip transfer apparatus, and chip transfer method

Patent 10566219 was granted and assigned to Toshiba on February, 2020 by the United States Patent and Trademark Office.

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Patent abstract

According to one embodiment, a chip transfer member includes a light-transmitting portion and a metal portion. The light-transmitting portion has a light incident surface, a light-emitting surface, and a side surface. The metal portion is provided at the side surface of the light-transmitting portion.

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