Patent 10566503 was granted and assigned to Hitachi, Ltd. on February, 2020 by the United States Patent and Trademark Office.
The purpose of the present invention is to decrease the process temperature for a multilayer glass into which an optical element is to be packed, thereby reducing the damage to the optical element during processing. A multilayer glass according to the present invention is so configured that a gap formed between glass plates is sealed with a sealing material that can fix at a process temperature lower than a temperature employed for the processing of an optical element (see FIG. 1).