US Patent 10572622 Interconnect reuse resolution with bump compensation in a package design

This application discloses a computing system to export route data and connectivity data from a layout design of a package device. The route data describes a structure of an interconnect in the package device. The connectivity data characterizes an electrical interface between a first integrated circuit and the package device in the layout design. The computing system, based on the connectivity data associated with the first integrated circuit, can correlate the route data to pins of a second integrated circuit and identify net names for the route data and the second integrated circuit. The computing system can import the route data and the connectivity data to the layout design, which selectively realigns the route data in the layout design with the pins in the second integrated circuit, and also can allow the computing system to change net names corresponding to the route data connecting to the second integrated circuit.