US Patent 10573505 SiC wafer producing method
Patent 10573505 was granted and assigned to Disco Corporation on February, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
January 30, 2018
0
Date of Patent
February 25, 2020
0
Patent Applicant
Patent Application Number
15883297
0
Patent Inventor Names
Kazuya Hirata
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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