US Patent 10573573 Package and package-on-package structure having elliptical conductive columns
Is a
Date Filed
March 20, 2018
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Date of Patent
February 25, 2020
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Patent Application Number
15925790
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Patent Inventor Names
Chen-Shien Chen
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Kuo-Hui Chang
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Sheng-Huan Chiu
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Yi-Jen Lai
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Chun-Jen Chen
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Chung-Yi Lin
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Hsi-Kuei Cheng
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Kuo-Chio Liu
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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