Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yenting Wen0
Jefferson W. Hall0
Michael J. Seddon0
Date of Patent
February 25, 2020
Patent Application Number
16106638
Date Filed
August 21, 2018
Patent Primary Examiner
Patent abstract
A semiconductor package includes a semiconductor die. A through hole in the semiconductor package and semiconductor die extends from one side of the semiconductor package and die to an opposite side of the semiconductor package and die. The through hole is configured to receive a current-carrying conductor there through. At least one current sensor is formed in, or on, the semiconductor die and configured to sense current flow in the current-carrying conductor received in the through hole.
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