Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 25, 2020
Patent Application Number
16191788
Date Filed
November 15, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
An apparatus for grounding a heat sink utilizing shape-memory alloy includes a printed circuit board, a logic chip, a heat sink, and a first grounding member, wherein the first grounding member is a shape-memory alloy. The apparatus further includes the logic chip electrically coupled to the printed circuit board and the heat sink disposed on a top surface of the logic chip. The apparatus further includes a first end of the first grounding member electrically coupled to the heat sink, wherein a second end of the grounding first member is disposed on a first ground land of the printed circuit board.
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