Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 3, 2020
Patent Application Number
16417899
Date Filed
May 21, 2019
Patent Citations Received
Patent Primary Examiner
Patent abstract
One embodiment provides for a processor comprising a three-dimensional (3D) integrated circuit stack including multiple graphics processor cores and interconnect logic to interconnect the graphics processor cores of the 3D integrated circuit stack to enable data distribution between the graphics processor cores over a virtual channel including multiple programmatically pre-assigned traffic classifications.
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