US Patent 10580717 Multiple-chip package with multiple thermal interface materials
Patent 10580717 was granted and assigned to Intel on March, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
January 11, 2016
0
Date of Patent
March 3, 2020
0
Patent Applicant
Patent Application Number
15774990
0
Patent Inventor Names
Hemanth K. Dhavaleswarapu
0
Boxi Liu
0
James C. Matayabas, Jr.
0
Syadwad Jain
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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