Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chun-Te Lee0
Chin-Tang Hsieh0
Date of Patent
March 3, 2020
0Patent Application Number
159528140
Date Filed
April 13, 2018
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A chip on film package includes a chip and a flexible substrate having a film and a circuit layer. The circuit layer is formed on a first surface of the film and electrically connected to the chip. At least one groove is recessed on a second surface of the film. The flexible substrate is bent to form flat portions and at least one curved portion located between the flat portions when it is bonded to external electronic components. The groove is located on the curved portion and provided to protect the curved portion of the flexible substrate from breaking.
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