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US Patent 10580738 Direct bonded heterogeneous integration packaging structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 20, 2018
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Date of Patent
March 3, 2020
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Patent Application Number
15926044
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Patent Citations
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US Patent 10224272 Semiconductor package including a rewiring layer with an embedded chip
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US Patent 10418329 Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
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US Patent 10163798 Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
Patent Citations Received
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US Patent 10847467 Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same
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US Patent 11393760 Floating-bridge interconnects and methods of assembling same
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US Patent 11791270 Direct bonded heterogeneous integration silicon bridge
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US Patent 11605594 Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate
Patent Inventor Names
Arvind Kumar
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Maryse Cournoyer
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Steve Ostrander
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Valérie A. Oberson
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Charles L. Arvin
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Dinesh Gupta
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Jon A. Casey
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Joshua Rubin
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Kamal K. Sikka
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Lawrence A. Clevenger
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10580738
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Patent Primary Examiner
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Ida M. Soward
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