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US Patent 10580817 Photodetector

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
May 10, 2019
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Date of Patent
March 3, 2020
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Patent Application Number
16409494
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Patent Citations Received
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US Patent 11790219 Three dimensional circuit implementing machine trained network
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US Patent 10804309 Photodetector
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US Patent 10886177 3D chip with shared clock distribution network
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US Patent 10892252 Face-to-face mounted IC dies with orthogonal top interconnect layers
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US Patent 10950547 Stacked IC structure with system level wiring on multiple sides of the IC die
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US Patent 10964834 Photodetector and light detection and ranging
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US Patent 10970627 Time borrowing between layers of a three dimensional chip stack
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US Patent 10978348 3D chip sharing power interconnect layer
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US Patent 11599299 3D memory circuit
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US Patent 11289333 Direct-bonded native interconnects and active base die
•••
Patent Inventor Names
Toshifumi Wakano
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Junpei Yamamoto
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Masahiko Nakamizo
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Ryusei Naito
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Yusuke Otake
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Akira Matsumoto
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10580817
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Patent Primary Examiner
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Caleen O Sullivan
0

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