Is a
Patent attributes
Patent Applicant
0
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wen-Bo Ding0
Chien-Kee Pang0
Sheng Zhang0
Zhi-Rui Sheng0
Chien-En Hsu0
Date of Patent
March 3, 2020
0Patent Application Number
155861020
Date Filed
May 3, 2017
0Patent Citations Received
0
0
Patent Primary Examiner
Patent abstract
A wafer level packaging method includes the following steps. A first wafer is bonded over a second wafer. A first grinding process on the first wafer is performed, to remove an upper chamfered edge of the first wafer and reduce a thickness of the first wafer. A trimming process is performed on the first wafer, to remove a lower chamfered edge of the first wafer to form a trimmed first wafer. A second grinding process is performed on the trimmed first wafer, to reduce a thickness of the trimmed first wafer.
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