US Patent 10585250 Optical interconnect modules with polymer waveguide on silicon substrate

An optical interconnect device on a silicon substrate is disclosed which includes a trench having two slanted side walls opposite to each other, a number of polymer waveguides formed in the trench, each including a straight portion and two end reflectors formed on the slanted side walls of the trench, a light source and an optical receiver disposed on an insulated layer on the silicon surface outside the trench. Conductive lines are patterned on the insulating layer and connects to the light source and the optical receiver. The light source and the optical receiver are aligned respectively to the two end reflectors of each polymer waveguide such that an optical path is formed from the light source device through the plurality of polymer waveguides to the optical receiver device, via reflection by the two end reflectors. A fabrication method to build the device is disclosed thereof.