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US Patent 10586746 Semiconductor device and method
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Patent
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Date Filed
September 15, 2017
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Date of Patent
March 10, 2020
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Patent Application Number
15705567
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Patent Citations Received
US Patent 11508649 Semiconductor package including substrate with outer insulating layer
US Patent 11764344 Package structure and manufacturing method thereof
Patent Inventor Names
Sukianto Rusli
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10586746
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Patent Primary Examiner
Jasmine J Clark
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