US Patent 10587044 Flip-chip beamforming integrated circuit with integral thermal mass

A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, a bottom surface, and a plurality of interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a plurality of static interfaces and a plurality of RF interfaces. The plurality of static interfaces are on the bottom surface of the microchip and adjacent to each other. The plurality of RF interfaces are also on the bottom surface of the microchip, but radially outward of the plurality of static interfaces. The microchip is configured to be flip chip mounted.