Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 10, 2020
Patent Application Number
15947314
Date Filed
April 6, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of assembling a hermetically sealed printed circuit board includes: securing a first end portion of a wall of a cap to a substrate around an electrical contact region of the substrate, the wall including a second end portion disposed in an open configuration; mounting an electronic component to the electrical contact region of the substrate; and sealing the second end portion of the wall closed to form a hermetically sealed chamber between the substrate and the cap to encase the electronic component therein.
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