US Patent 10593563 Fan-out wafer level package with resist vias

Fan-out wafer level packages with resist vias are provided. In an implementation, an example wafer level process or panel fabrication process includes adhering a die to a carrier, applying a temporary resist layer over the die and the carrier, developing the resist layer to form channels or spaces, filling the channels or the spaces with a molding material, removing the remaining resist to create vias in the molding material, and metalizing the vias in the molding material to provide conductive vias for the microelectronics package. The methods automatically create good via and pad alignment. In another implementation, an example process includes adhering a die to a carrier, applying a permanent resist layer over the die and the carrier, developing the resist layer to form vias in the resist layer, and metalizing the vias in the remaining resist of the permanent resist layer to provide conductive vias for the microelectronics package. Assemblies may be constructed with the semiconductor dies face-up or face-down. One or more redistribution layers (RDLs) may be built on one or both sides of an assembly with resist vias.