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US Patent 10600735 3D chip sharing data bus

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Edits on 18 Oct, 2023

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Golden AI

edited on 18 Oct, 2023

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US Patent 11790219 Three dimensional circuit implementing machine trained network

Edits on 28 Apr, 2023

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Golden AI

edited on 28 Apr, 2023

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US Patent 10446207 Spin transfer torque magnetic random access memory for supporting operational modes with mode register

Edits on 25 Apr, 2023

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Golden AI

edited on 25 Apr, 2023

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US Patent 10269586 Package structure and methods of forming same

Edits on 6 Apr, 2023

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Golden AI

edited on 6 Apr, 2023

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US Patent 10886177 3D chip with shared clock distribution network

Edits on 5 Apr, 2023

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Golden AI

edited on 5 Apr, 2023

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US Patent 10950547 Stacked IC structure with system level wiring on multiple sides of the IC die

Edits on 2 Apr, 2023

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Golden AI

edited on 2 Apr, 2023

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US Patent 10892252 Face-to-face mounted IC dies with orthogonal top interconnect layers

Edits on 29 Mar, 2023

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Golden AI

edited on 29 Mar, 2023

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US Patent 10373657 Semiconductor layered device with data bus

Edits on 26 Mar, 2023

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Golden AI

edited on 26 Mar, 2023

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US Patent 10262911 Circuit for and method of testing bond connections between a first die and a second die

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Golden AI

edited on 25 Mar, 2023

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US Patent 11289333 Direct-bonded native interconnects and active base die

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Golden AI

edited on 25 Mar, 2023

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US Patent 11557516 3D chip with shared clock distribution network

Edits on 24 Mar, 2023

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Golden AI

edited on 24 Mar, 2023

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Patent Citations Received

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US Patent 10978348 3D chip sharing power interconnect layer

Edits on 8 Mar, 2023

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Golden AI

edited on 8 Mar, 2023

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Patent Citations Received

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US Patent 11599299 3D memory circuit

Edits on 18 Jan, 2023

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Golden AI

edited on 18 Jan, 2023

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Patent Citations Received

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US Patent 11557516 3D chip with shared clock distribution network

Edits on 26 Sep, 2022

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Golden AI

edited on 26 Sep, 2022

Infobox

Patent Citations Received

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US Patent 10886177 3D chip with shared clock distribution network

Edits on 25 Sep, 2022

"update citations for inverse infoboxes"

Golden AI

edited on 25 Sep, 2022

Infobox

Patent Citations Received

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US Patent 10892252 Face-to-face mounted IC dies with orthogonal top interconnect layers

Edits on 23 Sep, 2022

"update citations for inverse infoboxes"

Golden AI

edited on 23 Sep, 2022

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Patent Citations Received

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US Patent 10970627 Time borrowing between layers of a three dimensional chip stack

Edits on 23 Sep, 2022

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Golden AI

edited on 23 Sep, 2022

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Patent Citations Received

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US Patent 10978348 3D chip sharing power interconnect layer

"update citations for inverse infoboxes"

Golden AI

edited on 22 Sep, 2022

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Patent Citations

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US Patent 10269586 Package structure and methods of forming same

Edits on 30 Mar, 2022

"update inverses"

Golden AI

edited on 30 Mar, 2022

Edits made to:

Infobox (+1 properties)

Infobox

Patent citations received

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US Patent 11289333 Direct-bonded native interconnects and active base die

Edits on 11 Feb, 2022

"update inverses"

Golden AI

edited on 11 Feb, 2022

Edits made to:

Infobox (+1 properties)

Infobox

Patent citations received

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US Patent 10978348 3D chip sharing power interconnect layer

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