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US Patent 10602640 Memory coolers

Patent 10602640 was granted and assigned to Hewlett Packard Enterprise on March, 2020 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

Hewlett Packard Enterprise

Current Assignee

Hewlett Packard Enterprise

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

106026400

Date of Patent

March 24, 2020

Patent Application Number

161905960

Date Filed

November 14, 2018

Patent Citations Received

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US Patent 11937407 Photo-etched chassis cooling walls

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US Patent 11589480 Tubular heat spreaders for memory modules and memory modules incorporating the same

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US Patent 11785743 Temperature control of closely packed electronic assemblies

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US Patent 11832418 Liquid cooling module and its liquid cooling head

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US Patent 11246236 Liquid cooling jacket, liquid cooling system, and electronic device

Patent Primary Examiner

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Courtney L Smith

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