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US Patent 10607944 Dual-sided radio-frequency package with overmold structure

Patent 10607944 was granted and assigned to Skyworks Solutions, Inc. on March, 2020 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 11961805 Devices and methods related to dual-sided radio-frequency package with overmold structure
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 US Patent 10607944 Dual-sided radio-frequency package with overmold structure

Infobox
Is a
Patent
Patent
Patent applicant
Current assignee
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10607944
Date of patent
March 31, 2020
Patent application number
15724722
Date Filed
October 4, 2017
Patent citations
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US Patent 10034372 Stackable via package and method
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US Patent 10192816 Semiconductor package and fabricating method thereof
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US Patent 10206285 Stackable via package and method
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US Patent 10410885 Control of under-fill using under-fill deflash for a dual-sided ball grid array package
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US Patent 10410967 Electronic device comprising a conductive pad on a protruding-through electrode
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US Patent 10446479 Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
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US Patent 10460957 Control of under-fill using an encapsulant for a dual-sided ball grid array package
Patent primary examiner
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Phuc T. Dang

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