Golden has been acquired by ComplyAdvantage.Read about it here ⟶

‌

US Patent 10620377 Kinematic chip to chip bonding

Overview Structured Data Issues Contributors Activity

Is a

0

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

0

Patent Number

Date of Patent

April 14, 2020

0

Patent Application Number

150841640

Date Filed

March 29, 2016

0

Patent Citations Received

US Patent 12019293 Photonic system and method for its manufacture

0

US Patent 11686906 Self-aligned structure and method on interposer-based PIC

0

US Patent 11693196 Photonic die alignment

0

US Patent 11474317 Photonic system and method for its manufacture

US Patent 11237344 Photonic die alignment

Patent Primary Examiner

0

No article content yet.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 10620377 Kinematic chip to chip bonding

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Golden Query Tool