US Patent 10622320 Semiconductor package and method of manufacturing the same
Patent 10622320 was granted and assigned to Samsung on April, 2020 by the United States Patent and Trademark Office.
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Patent Number
106223200
Date of Patent
April 14, 2020
0Patent Application Number
158696780
Date Filed
January 12, 2018
0Official Website
Patent Primary Examiner
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US Patent 10622320 Semiconductor package and method of manufacturing the same
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10622320
Date of patent
April 14, 2020
Patent application number
15869678
Date Filed
January 12, 2018
Patent primary examiner
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