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US Patent 10629468 Device packaging using a recyclable carrier substrate
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Patent
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Date Filed
February 10, 2017
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Date of Patent
April 21, 2020
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Patent Application Number
15429416
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Patent Citations Received
US Patent 11542153 Segmented pedestal for mounting device on chip
US Patent 10910272 Reusable support substrate for formation and transfer of semiconductor devices and methods of using the same
US Patent 11401162 Method for transferring a useful layer into a supporting substrate
US Patent 11502067 Package structure and method for manufacturing the same
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10629468
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Patent Primary Examiner
Seahvosh Nikmanesh
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