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US Patent 10636702 Conductive interconnect structures in integrated circuits

Patent 10636702 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2020 by the United States Patent and Trademark Office.

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Edits on 7 Dec, 2023
"update inverses"
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Golden AI
edited on 7 Dec, 2023
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Patent Citations Received
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US Patent 11837651 Semiconductor device having isolation fins
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Edits on 20 May, 2023
"Remove website redirecting to Patent Public Search front page"
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Golden AI
edited on 20 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1063670200
Edits on 26 Mar, 2023
"Entity importer update"
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Golden AI
edited on 26 Mar, 2023
Infobox
Is a
Patent
Patent
0
Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
0
Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
106367020
Date of Patent
April 28, 2020
0
Patent Application Number
161784700
Date Filed
November 1, 2018
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=106367020
Patent Citations Received
‌
US Patent 10872815 Conductive interconnect structures in integrated circuits
0
Patent Primary Examiner
‌
Brook Kebede
0
Edits on 28 Sep, 2022
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 28 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
0
Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
106367020
Date of Patent
April 28, 2020
0
Patent Application Number
161784700
Date Filed
November 1, 2018
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=106367020
Patent Citations Received
‌
US Patent 10872815 Conductive interconnect structures in integrated circuits
0
Patent Primary Examiner
‌
Brook Kebede
0
Edits on 8 Jun, 2022
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 8 Jun, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10636702
Edits on 8 Feb, 2022
"update inverses"
Golden AI profile picture
Golden AI
edited on 8 Feb, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
‌
US Patent 10872815 Conductive interconnect structures in integrated circuits
Edits on 3 Feb, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 3 Feb, 2022
Edits made to:
Infobox (+9 properties)
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 US Patent 10636702 Conductive interconnect structures in integrated circuits

Infobox
Is a
Patent
Patent
Patent applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Current assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10636702
Date of patent
April 28, 2020
Patent application number
16178470
Date Filed
November 1, 2018
Patent primary examiner
‌
Brook Kebede

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