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US Patent 10643927 Ring isolated through-substrate vias for high resistivity substrates

Patent 10643927 was granted and assigned to GlobalFoundries on May, 2020 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12125923 High voltage diode on SOI substrate with trench-modified current path
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US Patent 12009293 Barrier-free interconnect structure and manufacturing method thereof
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1064392700
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US Patent 11482445 Method for manufacturing semiconductor structure
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Infobox
Is a
Patent
Patent
0
Current Assignee
GlobalFoundries
GlobalFoundries
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
106439270
Date of Patent
May 5, 2020
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Patent Application Number
161929990
Date Filed
November 16, 2018
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=106439270
Patent Citations Received
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US Patent 11264457 Isolation trenches augmented with a trap-rich layer
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US Patent 11276637 Barrier-free interconnect structure and manufacturing method thereof
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Patent Primary Examiner
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Jay C Chang
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Edits on 24 Sep, 2022
"update citations for inverse infoboxes"
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edited on 24 Sep, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10643927
Edits on 16 Mar, 2022
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edited on 16 Mar, 2022
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Patent citations received
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US Patent 11276637 Barrier-free interconnect structure and manufacturing method thereof
Edits on 3 Mar, 2022
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edited on 3 Mar, 2022
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Patent citations received
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US Patent 11264457 Isolation trenches augmented with a trap-rich layer
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 US Patent 10643927 Ring isolated through-substrate vias for high resistivity substrates

Infobox
Is a
Patent
Patent
Current assignee
GlobalFoundries
GlobalFoundries
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10643927
Date of patent
May 5, 2020
Patent application number
16192999
Date Filed
November 16, 2018
Patent primary examiner
‌
Jay C Chang

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