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US Patent 10644039 Wiring layer and manufacturing method therefor
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Edits on 16 Oct, 2024
"update inverses"
Golden AI
edited on 16 Oct, 2024
Edits made to:
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+1
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Patent Citations Received
US Patent 12119353 Semiconductor device, electronic component, and electronic device
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Edits on 27 Sep, 2023
"update inverses"
Golden AI
edited on 27 Sep, 2023
Edits made to:
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+1
properties)
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Patent Citations Received
US Patent 11770939 Semiconductor device
Edits on 20 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 20 May, 2023
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-1
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10644039
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Edits on 25 Sep, 2022
"Entity importer update"
Golden AI
edited on 25 Sep, 2022
Infobox
Is a
Patent
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10644039
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Date of Patent
May 5, 2020
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Patent Application Number
16423884
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Date Filed
May 28, 2019
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10644039
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Patent Primary Examiner
Douglas M. Menz
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Edits on 8 Jun, 2022
"Entity importer update"
Golden AI
edited on 8 Jun, 2022
Edits made to:
Infobox
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+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10644039
Edits on 3 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 3 Feb, 2022
Edits made to:
Infobox
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+7
properties)
US Patent 10644039 Wiring layer and manufacturing method therefor
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10644039
Date of patent
May 5, 2020
Patent application number
16423884
Date Filed
May 28, 2019
Patent primary examiner
Douglas M. Menz
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