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US Patent 10651131 Supporting InFO packages to reduce warpage

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Edits on 20 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1065113100
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Patent Citations Received
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US Patent 11594516 Semiconductor package and method of manufacturing semiconductor package
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10651131
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 US Patent 10651131 Supporting InFO packages to reduce warpage

Infobox
Is a
Patent
Patent
Patent applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Current assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10651131
Date of patent
May 12, 2020
Patent application number
16027580
Date Filed
July 5, 2018
Patent citations
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US Patent 10068852 Integrated circuit package with embedded bridge
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US Patent 10163780 Wireless charging package with chip integrated in coil center
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US Patent 10325841 Semiconductor device
Patent primary examiner
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Dale E Page

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