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US Patent 10656200 High volume system level testing of devices with pop structures

Overview Structured Data Issues Contributors Activity

Is a

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

May 19, 2020

Patent Application Number

15650970

Date Filed

July 16, 2017

Patent Citations Received

US Patent 11940487 Thermal solution for massively parallel testing

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US Patent 11841392 Integrated test cell using active thermal interposer (ATI) with parallel socket actuation

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US Patent 11852678 Multi-input multi-zone thermal control for device testing

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US Patent 11493551 Integrated test cell using active thermal interposer (ATI) with parallel socket actuation

US Patent 11549981 Thermal solution for massively parallel testing

US Patent 11567119 Testing system including active thermal interposer device

US Patent 11573262 Multi-input multi-zone thermal control for device testing

US Patent 11587640 Carrier based high volume system level testing of devices with pop structures

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Patent Primary Examiner

Melissa J Koval

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