US Patent 10658279 High density package interconnects

Patent 10658279 was granted and assigned to Intel on May, 2020 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

Intel

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10658279

Date of Patent

May 19, 2020

Patent Application Number

16261475

Date Filed

January 29, 2019

Patent Citations Received

‌

US Patent 12002776 Interconnect structure and method for forming the same

‌

US Patent 11532580 Interconnect structure, semiconductor structure including interconnect structure and method for forming the same

Patent Primary Examiner

‌

Christine A Enad

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