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US Patent 10658324 Semiconductor device

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Patent Citations Received
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US Patent 11444036 Power module assembly
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10658324
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US Patent 11444036 Power module assembly
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Patent Citations Received
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US Patent 11444036 Power module assembly
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US Patent 11444036 Power module assembly
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 US Patent 10658324 Semiconductor device

Infobox
Is a
Patent
Patent
Patent applicant
Mitsubishi Electric Corporation
Mitsubishi Electric Corporation
Current assignee
Mitsubishi Electric Corporation
Mitsubishi Electric Corporation
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10658324
Date of patent
May 19, 2020
Patent application number
16107966
Date Filed
August 21, 2018
Patent citations
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US Patent 10032689 Double-side cooling type power module and producing method thereof
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US Patent 10163858 Semiconductor packages and manufacturing methods thereof
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US Patent 10163860 Semiconductor package structure
Patent primary examiner
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David A Zarneke

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