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US Patent 10658356 Semiconductor device and semiconductor package
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Patent
Date Filed
August 28, 2018
Date of Patent
May 19, 2020
Patent Application Number
16114780
Patent Citations Received
US Patent 11646732 Power module
0
US Patent 10755988 Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10658356
Patent Primary Examiner
John W Poos
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