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US Patent 10665529 Modular microjet cooling of packaged electronic components

Patent 10665529 was granted and assigned to Massachusetts Institute of Technology on May, 2020 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Massachusetts Institute of Technology

Current Assignee

Massachusetts Institute of Technology

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

106655290

Date of Patent

May 26, 2020

Patent Application Number

160394920

Date Filed

July 19, 2018

Patent Citations Received

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US Patent 11844193 Direct contact fluid based cooling module

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US Patent 11963341 High temperature electronic device thermal management system

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US Patent 12016157 Actively cooled heat-dissipation lids for computer processors and assemblies

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US Patent 10903141 Thermal management of RF devices using embedded microjet arrays

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US Patent 10962869 Cooling device used for cooling a heat-generating body, projector including the cooling device, and heat-receiving unit used in the cooling device

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US Patent 11018077 Modular microjet cooling of packaged electronic components

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US Patent 11594470 Modular microjet cooling of packaged electronic components

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Patent Primary Examiner

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Adam B Dravininkas

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