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US Patent 10665936 Wireless module and method for manufacturing wireless module

Patent 10665936 was granted and assigned to TAIYO YUDEN CO., LTD on May, 2020 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 11984857 Impedance transformation circuit for amplifier
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1066593600
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Patent citations received
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US Patent 11347273 Electronic device module, method of manufacturing the same and electronic apparatus
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Patent citations received
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US Patent 10868364 Wireless module and method for manufacturing the same
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 US Patent 10665936 Wireless module and method for manufacturing wireless module

Infobox
Is a
Patent
Patent
Patent applicant
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TAIYO YUDEN CO., LTD
Current assignee
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TAIYO YUDEN CO., LTD
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10665936
Date of patent
May 26, 2020
Patent application number
15828191
Date Filed
November 30, 2017
Patent citations
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US Patent 10163867 Semiconductor package and manufacturing method thereof
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US Patent 10283859 Selective shielding of radio frequency modules
Patent primary examiner
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Ab Salam Alkassim, Jr.

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