US Patent 10666264 3D stacked integrated circuits having failure management
Patent 10666264 was granted and assigned to Micron Technology on May, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 13, 2018
Date of Patent
May 26, 2020
Patent Applicant
Patent Application Number
16218889
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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