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US Patent 10672654 Microelectronic assembly from processed substrate
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Patent
Date Filed
December 20, 2017
Date of Patent
June 2, 2020
Patent Application Number
15849325
Patent Citations Received
US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
US Patent 11804377 Method for preparing a surface for direct-bonding
US Patent 11929347 Mixed exposure for large die
0
US Patent 11552041 Chemical mechanical polishing for hybrid bonding
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10672654
Patent Primary Examiner
Long Pham
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