Create
Log in
Sign up
Golden has been acquired by ComplyAdvantage.
Read about it here ⟶
US Patent 10672820 Hybrid bonded structure
Overview
Structured Data
Issues
Contributors
Activity
All edits
Edits on 16 Oct, 2024
"update inverses"
Golden AI
edited on 16 Oct, 2024
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent Citations Received
US Patent 12119318 Bonding structure and method of forming same
0
Edits on 26 Jun, 2024
"update inverses"
Golden AI
edited on 26 Jun, 2024
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent Citations Received
US Patent 12021057 Semiconductor structure and semiconductor die
0
Edits on 31 May, 2023
"update inverses"
Golden AI
edited on 31 May, 2023
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent Citations Received
US Patent 11664336 Bonding structure and method of forming same
0
Edits on 23 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 23 May, 2023
Edits made to:
Infobox
(
-1
properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10672820
0
Edits on 24 Apr, 2023
"Entity importer update"
Golden AI
edited on 24 Apr, 2023
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10672820
0
Date of Patent
June 2, 2020
0
Patent Application Number
15983104
0
Date Filed
May 18, 2018
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10672820
0
Patent Citations Received
US Patent 11380645 Semiconductor structure comprising at least one system-on-integrated-circuit component
0
Patent Primary Examiner
Fazli Erdem
0
Edits on 27 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 27 Sep, 2022
Infobox
Patent Citations Received
US Patent 11380645 Semiconductor structure comprising at least one system-on-integrated-circuit component
0
Edits on 6 Jul, 2022
"update inverses"
Golden AI
edited on 6 Jul, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent citations received
US Patent 11380645 Semiconductor structure comprising at least one system-on-integrated-circuit component
Edits on 8 Jun, 2022
"Entity importer update"
Golden AI
edited on 8 Jun, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10672820
Edits on 4 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 4 Feb, 2022
Edits made to:
Infobox
(
+7
properties)
US Patent 10672820 Hybrid bonded structure
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10672820
Date of patent
June 2, 2020
Patent application number
15983104
Date Filed
May 18, 2018
Patent primary examiner
Fazli Erdem
Find more entities like US Patent 10672820 Hybrid bonded structure
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Company
Home
Press & Media
Blog
Careers
WE'RE HIRING
Products
Knowledge Graph
Query Tool
Data Requests
Knowledge Storage
API
Pricing
Enterprise
ChatGPT Plugin
Legal
Terms of Service
Enterprise Terms of Service
Privacy Policy
Help
Help center
API Documentation
Contact Us
SUBSCRIBE