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US Patent 10685146 Overlapping, discrete tamper-respondent sensors
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Edits on 28 Jun, 2023
"update inverses"
Golden AI
edited on 28 Jun, 2023
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Patent Citations Received
US Patent 11685580 Medication counterfeit detection
0
Edits on 22 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 22 May, 2023
Edits made to:
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-1
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10685146
0
0
Edits on 27 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 27 Apr, 2023
Infobox
Patent Citations
US Patent 10177102 Tamper-proof electronic packages with stressed glass component substrate(s)
0
Edits on 25 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 25 Apr, 2023
Infobox
Patent Citations
US Patent 10237964 Manufacturing electronic package with heat transfer element(s)
0
Edits on 24 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 24 Apr, 2023
Infobox
Patent Citations
US Patent 10175064 Circuit boards and electronic packages with embedded tamper-respondent sensor
0
Edits on 23 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 23 Apr, 2023
Infobox
Patent Citations
US Patent 10169967 Multi-layer stack with embedded tamper-detect protection
0
"Entity importer update"
Golden AI
edited on 23 Apr, 2023
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10685146
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Date of Patent
June 16, 2020
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Patent Application Number
16358956
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Date Filed
March 20, 2019
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10685146
0
Patent Citations
US Patent 10098235 Tamper-respondent assemblies with region(s) of increased susceptibility to damage
0
US Patent 10115275 Multi-layer stack with embedded tamper-detect protection
0
US Patent 10136519 Circuit layouts of tamper-respondent sensors
0
US Patent 10143090 Circuit layouts of tamper-respondent sensors
0
US Patent 10168185 Circuit boards and electronic packages with embedded tamper-respondent sensor
0
US Patent 10169624 Tamper-proof electronic packages with two-phase dielectric fluid
0
US Patent 10169967 Multi-layer stack with embedded tamper-detect protection
0
US Patent 10169968 Multi-layer stack with embedded tamper-detect protection
0
US Patent 10172232 Tamper-respondent assemblies with enclosure-to-board protection
0
US Patent 10172239 Tamper-respondent sensors with formed flexible layer(s)
0
US Patent 10175064 Circuit boards and electronic packages with embedded tamper-respondent sensor
0
US Patent 10177102 Tamper-proof electronic packages with stressed glass component substrate(s)
0
US Patent 10178818 Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
0
US Patent 10217336 Multi-layer stack with embedded tamper-detect protection
0
US Patent 10237964 Manufacturing electronic package with heat transfer element(s)
0
Patent Primary Examiner
Malcolm Cribbs
0
"update citations for inverse infoboxes"
Golden AI
edited on 23 Apr, 2023
Infobox
Patent Citations
US Patent 10136519 Circuit layouts of tamper-respondent sensors
0
Edits on 1 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 1 Apr, 2023
Infobox
Patent Citations
US Patent 10172239 Tamper-respondent sensors with formed flexible layer(s)
0
Edits on 30 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 30 Mar, 2023
Infobox
Patent Citations
US Patent 10098235 Tamper-respondent assemblies with region(s) of increased susceptibility to damage
0
Edits on 28 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 28 Mar, 2023
Infobox
Patent Citations
US Patent 10178818 Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
0
Edits on 24 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 24 Mar, 2023
Infobox
Patent Citations
US Patent 10172232 Tamper-respondent assemblies with enclosure-to-board protection
0
Edits on 28 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 28 Sep, 2022
Infobox
Patent Citations
US Patent 10172239 Tamper-respondent sensors with formed flexible layer(s)
0
"update citations for inverse infoboxes"
Golden AI
edited on 28 Sep, 2022
Infobox
Patent Citations
US Patent 10237964 Manufacturing electronic package with heat transfer element(s)
0
Edits on 27 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 27 Sep, 2022
Infobox
Patent Citations
US Patent 10169967 Multi-layer stack with embedded tamper-detect protection
0
"update citations for inverse infoboxes"
Golden AI
edited on 27 Sep, 2022
Infobox
Patent Citations
US Patent 10115275 Multi-layer stack with embedded tamper-detect protection
0
Edits on 26 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 26 Sep, 2022
Infobox
Patent Citations
US Patent 10169968 Multi-layer stack with embedded tamper-detect protection
0
Edits on 24 Sep, 2022
"Entity importer update"
Golden AI
edited on 24 Sep, 2022
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10685146
0
Date of Patent
June 16, 2020
0
Patent Application Number
16358956
0
Date Filed
March 20, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10685146
0
Patent Citations
US Patent 10098235 Tamper-respondent assemblies with region(s) of increased susceptibility to damage
0
US Patent 10115275 Multi-layer stack with embedded tamper-detect protection
0
US Patent 10136519 Circuit layouts of tamper-respondent sensors
0
US Patent 10143090 Circuit layouts of tamper-respondent sensors
0
US Patent 10168185 Circuit boards and electronic packages with embedded tamper-respondent sensor
0
US Patent 10169624 Tamper-proof electronic packages with two-phase dielectric fluid
0
US Patent 10169967 Multi-layer stack with embedded tamper-detect protection
0
US Patent 10169968 Multi-layer stack with embedded tamper-detect protection
0
US Patent 10172232 Tamper-respondent assemblies with enclosure-to-board protection
0
US Patent 10172239 Tamper-respondent sensors with formed flexible layer(s)
0
US Patent 10175064 Circuit boards and electronic packages with embedded tamper-respondent sensor
0
US Patent 10177102 Tamper-proof electronic packages with stressed glass component substrate(s)
0
US Patent 10178818 Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
0
US Patent 10217336 Multi-layer stack with embedded tamper-detect protection
0
US Patent 10237964 Manufacturing electronic package with heat transfer element(s)
0
Patent Primary Examiner
Malcolm Cribbs
0
Edits on 8 Jun, 2022
"Entity importer update"
Golden AI
edited on 8 Jun, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10685146
Edits on 4 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 4 Feb, 2022
Edits made to:
Infobox
(
+22
properties)
US Patent 10685146 Overlapping, discrete tamper-respondent sensors
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10685146
Date of patent
June 16, 2020
Patent application number
16358956
Date Filed
March 20, 2019
Patent citations
US Patent 10098235 Tamper-respondent assemblies with region(s) of increased susceptibility to damage
US Patent 10115275 Multi-layer stack with embedded tamper-detect protection
US Patent 10136519 Circuit layouts of tamper-respondent sensors
US Patent 10143090 Circuit layouts of tamper-respondent sensors
US Patent 10168185 Circuit boards and electronic packages with embedded tamper-respondent sensor
US Patent 10169624 Tamper-proof electronic packages with two-phase dielectric fluid
US Patent 10169967 Multi-layer stack with embedded tamper-detect protection
US Patent 10169968 Multi-layer stack with embedded tamper-detect protection
US Patent 10172232 Tamper-respondent assemblies with enclosure-to-board protection
US Patent 10172239 Tamper-respondent sensors with formed flexible layer(s)
US Patent 10175064 Circuit boards and electronic packages with embedded tamper-respondent sensor
US Patent 10177102 Tamper-proof electronic packages with stressed glass component substrate(s)
US Patent 10178818 Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
US Patent 10217336 Multi-layer stack with embedded tamper-detect protection
US Patent 10237964 Manufacturing electronic package with heat transfer element(s)
Patent primary examiner
Malcolm Cribbs
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